Since its inception in 2000, UniTemp GmbH is constantly working in the development, manufacturing, sales and marketing of equipment for the semiconductor and microelectronics industry. Key products are single wafer RTP (rapid thermal process) ovens for various wafer sizes (100 mm, 150 mm, 200 mm and 300 mm) and reflow solder systems (up to 300 mm x 300 mm area). Our key competency is the manufacturing of compact and stylish table top systems with options and accessories according to customer requirements.

Beside the thermal process systems and a high precision hot plate we showcase our WB-300-U model, a semi-automatic wire bonder featuring three motorized axes.


Exhibits at E-MRS Spring Meeting 2023

  1. Rapid Thermal Process oven with temperature up to 1200 °C and ramp up rate to 150 K/sec.
  2. Semi-Automatic Wire Bonder with 3 motorized axes
  3. High precision hot plates up to 155 x 155 mm heated area



UniTemp GmbH
Luitpoldstr. 6
85276 Pfaffenhofen

Phone: +49 8441 787663
Fax: +49 8441 787664

Astrid Birkner
Phone: +49 8441 787663