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Biomaterials & Biointerfaces

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Flexible and Printed Electronics for Healthcare, Sensing, Actuation and Energy Applications and Interconnections

Printed electronics is a multidisciplinary research field spanning from fundamentals to fabrication and applications requiring flexible and stretchable alternatives. This symposium focuses on the emerging and advanced flexible and stretchable electronic materials, scientific insights, viable manufacturing technology and application.

Scope:

The form factors of electronics are rapidly transitioning from traditional rigid, planar designs to soft, flexible, bendable, and stretchable structures. These next-generation electronics include micro- and nanocomposites with conductive solid fillers made of carbon or metals, 1D and 2D fillers embedded in (bio)polymer matrices, as well as hybrid structures at the molecular and nanoscale. Conductive liquid metals, organic semiconductor films and blends, ionic stretchable conductors such as hydrogels, and their combinations further expand the landscape of emerging soft conductors. Such material systems conform to textiles and easily interface with biology and nature. This cutting-edge research, spanning large-area electronics, healthcare devices, energy technologies, and emerging human-computer interfaces, demands easily processable soft electronic materials.

This symposium will therefore focus on three fronts encompassing both fundamental and applied research:

  1. Emerging printing and coating technologies: 2D, 3D, and 4D printing, device integration, and interconnections
  2. Materials innovation: multifunctional inks, additives, fillers, sustainable and nature inspired materials
  3. Characterization, integration and applications: process–structure–property relations, rheological studies, electromechanical testing, interfaces with biological tissues, and applications in sensors, actuators, healthcare, wearables, energy, and related fields, device reliability and life-cycle assessment.

The successful development and deployment of such electronic materials requires close collaboration among researchers who synthesize, characterize, and integrate stretchable (semi)conductors. In parallel, the growing emphasis on sustainability and net-zero technologies calls for unconventional electronics that address environmental impact, develop nature-inspired solutions, and adopt alternative strategies for prototyping. Meeting these requirements demands high-performance and sustainable manufacturing processes with ultra-low energy consumption, alongside eco-friendly multifunctional materials with tailored properties.

Through a series of keynote, invited, and contributed presentations, this symposium aims to provide a comprehensive overview of the field, encompassing key innovation trends, enabling and breakthrough technologies, and emerging applications in flexible and printed electronics. The organizers will follow up with a Special Issue for publication in the proposed journal (e.g., Advanced Materials Technologies or International Journal of AI and Materials design).

Hot topics to be covered by the symposium:

  • Flexible/hybrid, stretchable, low cost, large area, green coating/printing (2D-4D) technologies;
  • Printable materials for sensors, actuators, smart textiles, wearables, solar cells, LEDs, energy;
  • Conformal bioelectronic materials based on human-device interfaces;
  • Materials for physical and chemical electronic sensing;
  • Liquid metals, conductive fillers/additives, nanocomposites, hyperelastic/ultrasoft conductors;
  • Advanced characterization techniques for printed materials;
  • In situ/operando techniques towards materials and device characterizations;
  • Environmental remediation, recycling, recovery, and circularity in soft electronics

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Symposium organizers
Esther GARCIA-TUNONUniversity of Liverpool

Harrison Hughes Building, The Quadrangle, University of Liverpool, L69 3GH, U.K.

egarciat@liverpool.ac.uk
Monika RAIHasselt University, Institute for Materials Research (IUMAT)

Wetenschapspark 1, 3590 Diepenbeek, Belgium

monika.rai@uhasselt.be
Shweta AGARWALASchool of Engineering and Applied Science (SEAS)

Ahmedabad University, Ahmedabad 380009, Gujrat, India

shweta.agarwala@ahduni.edu.in
Tobias KRAUSINM – Leibniz-Institute for New Materials

Campus D2 2, 66123 Saarbrücken, Germany

tobias.kraus@leibniz-inm.de
Wim DEFERME (Main organizer)Hasselt University, Institute for Materials Research (IUMAT)

Wetenschapspark 1, 3590 Diepenbeek, Belgium

wim.deferme@uhasselt.be