Biomaterials & Biointerfaces
UHigh-Performance and Intelligent Polymers for Electronics, Energy and Extreme Environments
High-performance and intelligent polymers are enabling the next generation of smart, resilient, and sustainable technologies. From materials that withstand extreme environments to systems that sense, respond, and adapt, they combine mechanical robustness with functional intelligence. Their integration with electronics, energy storage, and AI-driven design is opening pathways for multifunctional materials across aerospace, healthcare, and consumer technology.
Scope:
High-performance polymers and composites — such as PEEK and polyimides — are critical where resistance to extreme temperatures, mechanical stress, radiation, and corrosive conditions is required, including jet engines, spacecraft insulation, nuclear components, and bio-based composites for sustainable aerospace. Polymers also advance flexible electronics and bioelectronics — organic LEDs, electronic skin, biosensors — alongside energy-harvesting textiles of piezoelectric and triboelectric fibers for self-powered wearables and smart fabrics, with growing emphasis on biodegradability and design for disassembly. Machine learning and AI increasingly guide polymer design, predicting structure-property relationships and accelerating materials development. This feeds advanced architectures — self-healing, shape-memory, and stimuli-responsive systems — fabricated via 3D and 4D printing to embed adaptive functionality into device geometry. Finally, the symposium addresses polymers in energy storage: conductive polymers for solid-state batteries and high-performance electrolytes, and architectures that push energy density and charging speed for portable electronics.
Hot topics to be covered by the symposium:
- Extreme-environment polymers: Aerospace, nuclear, and marine applications
- High-performance composites: PEEK, polyimides, and radiation-resistant materials
- Flexible electronics: O-LEDs, electronic skin, biosensors
- Bio-interfaces: Wearable and bioelectronic technologies
- Recyclable electronics: Design for disassembly, biodegradable components
- Energy-harvesting textiles: Piezoelectric and triboelectric fibers
- Self-powered wearables: TENGs and smart fabrics
- Polymer informatics: AI and machine learning in materials design
- Structure-property prediction: Accelerated materials discovery
- Multifunctional architectures: Self-healing, shape memory, stimuli-responsive polymers
- 3D/4D printing: Fabrication of engineered, functionality-embedded structures
- Smart coatings: Self-cleaning and anti-corrosion surfaces
- High-performance energy storage: Conductive polymers, solid-state electrolytes, energy density and charging speed
Scientific Committee:
- Richard Friend, Professor of University of Cambridge, UK; fellow of Royal Society (UK) and Royal Academy of Engineering (UK).
- Merve Gültekinoğlu, Department of Nanotechnology and Nanomedicine, Hacettepe University, Türkiye
- Xianbo Huang, Chief Technology Officer of Kingfa Sci. & Tech. Co., China; Academician of Chinese Academy of Engineering.
- Victoire de Margerie, Executive Chair of Rondol Industrie, France; Member of Académie des technologies (France).
- Iain McCulloch, Professor of Princeton University, USA; fellow of Royal Society (UK), member of Academia Europaea and European Academy of Sciences.
- Christian Müller, Professor of Chalmers University of Technology, Sweden; member of Royal Swedish Academy of Engineering Sciences.
- Paolo Samorì, Professor of the University of Strasbourg; member of Académie des technologies (France) and Academia Europaea.
- Lise Trouillet-Fonti — Senior scientist, Syensqo - Research & Innovation Function, France.
- Claire Villevieille, CNRS Research Professor, Laboratoire d’Électrochimie et de Physico-chimie des Matériaux et des Interfaces, France.
- Xiaolin Xie — Professor, Huazhong University of Science and Technology, China.
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China
yanghuai@pku.edu.cnUK
m.edirisinghe@ucl.ac.ukCERMAV, Université Grenoble Alpes, France
redouane.borsali@univ-grenoble-alpes.frChinese Academy of Sciences
sfewhuang@mail.sysu.edu.cn